Thermal conductive silicone gap filling material 'TIA242GF'
Two-component addition-type silicone gel for heat dissipation and insulation sealing of electrical and electronic components.
TIA242GF is a thermally conductive silicone gap filling material that cures into a soft rubber or gel state by mixing component (A) and component (B) in a 1:1 ratio and either allowing it to sit at room temperature or heating it. After curing, it exhibits excellent heat resistance, cold resistance, and weather resistance, demonstrating stable thermal dissipation and electrical insulation over a wide temperature range. 【Features】 - High thermal conductivity, suitable for heat dissipation applications - Low fluidity, excellent shape retention - Cures quickly with heating above 70°C - Becomes a soft rubber or gel after curing, protecting components from various stresses - No corrosiveness to metals as it is an addition reaction type *For more details, please download the PDF or feel free to contact us.
- Company：日硝産業
- Price：Other
